SEOUL (Reuters) – South Korean smartphone builder LG Electronics Inc pronounced on Thursday that it encountered no overheating problems with Qualcomm Inc’s new Snapdragon processor that is powering a curved-screen device going on sale after this month.
“I am really most wakeful of a several concerns in a marketplace about a (Snapdragon) 810, though a chip’s opening is utterly satisfactory,” Woo Ram-chan, LG clamp boss for mobile product planning, told reporters during a press eventuality for a company’s G Flex2 smartphone.
The criticism came after Bloomberg reported a day progressing that Samsung Electronics Co Ltd, a world’s tip smartphone maker, motionless not to use a new Qualcomm processor for a subsequent flagship Galaxy S smartphone after a chip overheated during testing. Samsung and Qualcomm have declined to criticism on a report, that cited unclear sources.
Samsung is widely approaching to betray a new Galaxy S smartphone in early March, and Bloomberg reported that a Korean organisation will use a possess processors instead.
But LG’s Woo pronounced on Thursday that inner tests for a G Flex2, powered by a new Qualcomm processor, uncover that a new product emits reduction feverishness than other existent devices. The new phone is scheduled to start offered in South Korea on Jan. 30.
“I don’t know because there is a emanate over heat,” he said.
(Reporting by Se Young Lee)
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